INTEGRATED CIRCUITS
DATA SHEET
TDA7056AT
3 W mono BTL audio amplifier with
DC volume control
1998 Feb 23
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
BLOCK DIAGRAM
V
n.c.
P
1 to 3, 8 to 13,
16, 18 to 20
4
+
−
I + i
TDA7056AT
14
17
positive output
5
positive input
+
7
DC volume control
−
I − i
negative output
+
TEMPERATURE
PROTECTION
V
STABILIZER
ref
6
15
MGM576
signal
power
ground ground
Fig.1 Block diagram.
1998 Feb 23
3
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
PINNING
SYMBOL
n.c.
PIN
DESCRIPTION
not connected
1
2
n.c.
not connected
not connected
positive supply voltage
positive input
handbook, halfpage
n.c.
3
n.c.
n.c.
n.c.
20 n.c.
1
2
VP
4
19
n.c.
18 n.c.
17
VI
5
3
GND1
VC
6
signal ground
DC volume control
not connected
not connected
not connected
not connected
not connected
not connected
positive output
power ground
not connected
negative output
not connected
not connected
not connected
V
P
OUT−
4
7
V
I
16 n.c.
5
n.c.
8
TDA7056AT
n.c.
9
GND1
VC
6
15 GND2
n.c.
10
11
12
13
14
15
16
17
18
19
20
OUT+
7
14
n.c.
n.c.
8
13 n.c.
n.c.
n.c.
n.c.
n.c.
9
12
11
n.c.
n.c.
10
OUT+
GND2
n.c.
MGM577
OUT−
n.c.
n.c.
Fig.2 Pin configuration.
n.c.
1998 Feb 23
4
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
The maximum gain of the amplifier is fixed at 35.5 dB.
The DC volume control stage has a logarithmic control
characteristic.
FUNCTIONAL DESCRIPTION
The TDA7056AT is a mono BTL output amplifier with DC
volume control. It is designed for use in TVs and monitors
but is also suitable for battery-fed portable recorders and
radios.
The total gain can be controlled from +35.5 to −44 dB.
If the DC volume control voltage is below 0.3 V, the device
switches to the mute mode.
In conventional DC volume circuits the control or input
stage is AC-coupled to the output stage via external
capacitors to keep the offset voltage low. In the
TDA7056AT the DC volume control stage is integrated into
the input stage so that no coupling capacitors are required.
With this configuration, a low offset voltage is still
maintained and the minimum supply voltage remains low.
The amplifier is short-circuit proof to ground, VP and
across the load. A thermal protection circuit is also
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.
The BTL principle offers the following advantages:
• Lower peak value of the supply current
Power dissipation
• The frequency of the ripple on the supply voltage is twice
the signal frequency.
Assume VP = 12 V; RL = 16 Ω.
The maximum sine wave dissipation is 1.8 W.
Consequently, a reduced power supply with smaller
capacitors can be used which also results in cost
reductions. For portable applications there is a trend to
decrease the supply voltage, resulting in a reduction of
output power at conventional output stages. Using the BTL
principle increases the output power.
The Rth vj-a of the package is 60 K/W.
Therefore Tamb(max) = 150 − 60 × 1.8 = 42 °C.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS
supply voltage
MIN.
MAX.
18
UNIT
VP
−
−
−
−
−
V
V
A
A
V5, 7
IORM
IOSM
Ptot
Tamb
Tstg
Tvj
input voltage pins 5 and 7
repetitive peak output current
non-repetitive peak output current
total power dissipation
5
1.25
1.5
1.5
+85
+150
150
1
Tcase < 60 °C
W
°C
°C
°C
h
operating ambient temperature
storage temperature
−40
−55
−
virtual junction temperature
short-circuit time
tsc
−
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
in free air
VALUE
60
UNIT
Rth(j-a)
thermal resistance from junction to ambient
K/W
1998 Feb 23
5
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
CHARACTERISTICS
VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 Ω; Tamb = 25 °C; unless otherwise specified (see Fig.14).
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
supply voltage
total quiescent current
4.5
−
8
18
V
Iq(tot)
RL = ∞; note 1
−
16
mA
Maximum gain (V7 = 1.4 V)
Po
output power
THD = 10%; RL = 16 Ω
Po = 0.5 W
3
3.5
0.3
−
1
W
THD
Gv(max)
Vi(rms)
total harmonic distortion
maximum total voltage gain
input signal handling (RMS value)
−
34.5
%
35.5
36.5
−
dB
V
VVC = 0.8 V; THD < 1% 0.5
0.65
Vn(o)(rms) noise output voltage (RMS value)
f = 500 kHz; note 2
at −1 dB
−
−
38
−
210
−
−
−
150
25
µV
kHz
dB
mV
kΩ
B
bandwidth
0.02 to 300
SVRR
∆VOS
Zi
supply voltage ripple rejection
DC output offset voltage
input impedance (pin 3)
note 3
46
0
V17 − v14
15
20
Minimum gain (V7 = 0.5 V)
Gv voltage gain
−
−
−44
20
−
30
dB
Vo(n)(rms) noise output voltage (RMS value)
note 4
µV
Mute position
Vo(mute)
output voltage in mute position
VVC ≤ 0.3 V;
VI = 600 mV; note 4
−
35
45
µV
DC volume control
∆Gv
IVC
voltage gain control range
control current
75
60
80
70
−
80
dB
VVC = 0 V
µA
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (Vn(o)(rms)) at f = 500 kHz, is measured with Rs = 0 Ω and B = 5 kHz.
3. The ripple rejection is measured with Rs = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage (Vripple = 200 mV RMS)
is applied to the positive supply rail.
4. The noise output voltage (Vn(o)(rms)) is measured with Rs = 5 kΩ unweighted.
1998 Feb 23
6
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
MGM578
MGM579
20
12
handbook, halfpage
handbook, halfpage
I
THD
(%)
10
q
(mA)
16
8
6
4
2
0
12
8
4
(1)
0
−1
0
4
8
12
16
20
10
1
10
P
(W)
o
V
(V)
P
V5 = 1.4 V; no load.
VDC = 1.4 V.
(1) VP = 12 V; RL = 16 Ω.
Fig.3 Quiescent current as a function of the
supply voltage.
Fig.4 THD as a function of output power.
MGM580
MGM581
8
100
handbook, halfpage
handbook, halfpage
RR
(dB)
THD
(%)
80
60
40
20
6
4
2
(1)
(2)
(3)
(1)
0
10
0
10
2
3
4
5
2
3
4
5
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
VP = 12 V; RL = 16 Ω; Vr = 200 mV.
(1) V7 = 0.3 V; Rs = 5 kΩ.
(2) V7 = 1.4 V; Rs = 0 Ω.
VP = 12 V, Po = 0.5 W, VDC = 1.4 V.
(1) RL = 16 Ω.
(3) V7 = 1.4 V; Rs = 5 kΩ.
Fig.5 THD as a function of frequency.
Fig.6 Ripple rejection as a function of frequency.
1998 Feb 23
7
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
MGM583
MGM582
1000
40
handbook, halfpage
gain
handbook, halfpage
V
n
(dB)
(µV)
20
800
0
−20
−40
−60
−80
600
400
200
0
0
0.4
0.8
1.2
1.6
2.0
0
0.4
0.8
1.2
1.6
2.0
V
(V)
V
(V)
7
7
Measured with Rs = 5 kΩ unweighted; f = 22 Hz to 22 kHz.
Fig.7 Gain control as a function of DC volume
control.
Fig.8 Noise output voltage as a function of DC
volume control.
MGM585
MGM584
5
1000
handbook, halfpage
handbook, halfpage
P
V
o
i
(W)
4
(mV)
800
3
600
400
200
0
(1) (2) (3)
2
1
0
0
4
8
12
16
20
0
4
8
12
16
20
V
(V)
V
(V)
P
P
Measured at THD = 10%. The maximum output power is limited by
the maximum power dissipation and the maximum available output
current.
(1) RL = 8 Ω.
(2)
RL = 16 Ω.
Tamb = 25 °C; THD = 1%; RL = 16 Ω; VDC = 0.8 V.
(3) RL = 25 Ω.
Fig.9 Input signal handling as a function of the
supply voltage.
Fig.10 Output power as a function of the supply
voltage.
1998 Feb 23
8
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
MGM586
MGM587
3
100
handbook, halfpage
handbook, halfpage
I
5
(µA)
P
(W)
60
2
20
−20
−60
(1)
(2)
(3)
1
0
−100
0
0.4
0.8
1.2
1.6
2.0
0
4
8
12
16
20
V
(V)
V
(V)
P
7
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) RL = 25 Ω.
Fig.11 Total worst case power dissipation as a
function of supply voltage.
Fig.12 Control current as a function of DC volume
control.
1998 Feb 23
9
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
a. Top view of bottom copper.
GND
+V
P
220 µF
100 nF
0.47 µF
IN
20
1
−OUT
5 kΩ
TDA7056A/BT
100
nF
+OUT
D&A AUDIO POWER
CIC NIJMEGEN
volume
MGM591
b. Top view of component side.
Fig.13 Printed-circuit board layout.
10
1998 Feb 23
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
TEST AND APPLICATION INFORMATION
Test conditions
Thermal behaviour:
The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductors manufacturers because the
application boards and test methods are not (yet)
standardized. The thermal performance of packages for a
specific application may also be different than presented
here, because the configuration of the application boards
(copper area) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz copper traces
with solder coating. The measurements have been carried
out with vertical placed boards.
T
amb = 25 °C if not specified: VP = 12 V; VDC = 1.4 V;
f = 1 kHz; RL = 16 Ω; audio bandpass: 22 Hz to 22 kHz.
In Figures 5 and 6 a low-pass filter of 80 kHz was applied.
It should be noted that capacitive loads (100 pF and 5 nF)
connected between the output pins to a common ground
can cause oscillations. The BTL application circuit diagram
is shown in Fig.14. To avoid instabilities and too high
distortion, the input and power ground traces must be
separated as far as possible and connected together as
close as possible to the IC. The quiescent current has
been measured without load impedance.
Using a practical PCB layout with wider copper tracks and
some copper area to the IC pins and just under the IC, the
thermal resistance from junction to ambient can be
reduced. In the demonstration application PCB the
Rth(j-a) = 56 K/W for the SO20 plastic package. For a
maximum ambient temperature of Tamb = 50 °C the
following calculation can be made for the maximum power
Voltage gain
The maximum closed-loop voltage gain has been
internally fixed at 35.5 dB. The input sensitivity at
maximum gain for Po = 3 W (RL = 16 Ω) is 115 mV.
The gain bandwidth is 20 Hz to 300 kHz within 1 dB.
(150 K/W – 50 K/W)
dissipation:
= 1.79 W
------------------------------------------------------
Output power
56 K/W
The output power as a function of supply voltage has been
measured at THD = 10%. The maximum output power is
limited by the maximum allowed power dissipation at
For the application at VP = 12 V and RL = 16 Ω the worst
case sine wave dissipation is 1.85 W. Because in practice
the ‘music-power’ causes about the half of the sine wave
dissipation, this application (VP = 12 V; RL = 16 Ω) has
Tamb = 25 °C approximately 2 W, and the maximum
available output current is 1.25 A repetitive peak current.
been allowed.
Switch-on/switch-off
Short-circuit protection:
The switch-on behaviour depends on the following:
The output pins (pins 14 and 17) can be short-circuited to
ground respectively to +VP. The Missing Current Limiter
(MCL) protection circuit will shut-off the amplifier.
Removing the short-circuit will reset the amplifier
automatically. Short-circuit across the load
• The rise time of the power supply (if tr > 40 ms for
VP = 0 to 12 V then the switch-on behaviour will be
good)
• The input capacitor and source impedance (a higher
source impedance and/or lower input capacitor value
will have a positive influence on the switch-on/switch-off
behaviour)
(pins 14 and 17) will activate the thermal protection circuit;
this will result in reducing the short-circuit current.
• The DC volume control pin (a capacitor of >0.1 µF
avoids disturbances).
1998 Feb 23
11
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
V
P
(1)
100 nF
220 µF
n.c.
1 to 3, 8 to 13,
16, 18 to 20
4
+
−
I + i
TDA7056AT
14
17
0.47 µF
5
positive input
+
7
R
= 16 Ω
L
−
I − i
+
STABILIZER
TEMPERATURE
PROTECTION
5
kΩ
R
s
V
ref
DC
volume
control
6
15
MGM588
ground
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 2.
Fig.14 Test and application diagram.
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MLC) will be activated.
1998 Feb 23
12
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
V
= 12 V
handbook, halfpage
P
handbook, halfpage
82 kΩ
volume
control
7
TDA7056AT
7
TDA7056AT
1 µF
1 µF
100 kΩ
22 kΩ
GND
GND
MGM589
volume
control
MGM590
Fig.15 Application with potentiometer as volume
control; maximum gain = 30 dB.
Fig.16 Application with potentiometer as volume
control; maximum gain = 36 dB.
1998 Feb 23
13
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT163-1
075E04
MS-013AC
1998 Feb 23
14
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
SOLDERING
Introduction
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1998 Feb 23
15
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Feb 23
16
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
NOTES
1998 Feb 23
17
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
NOTES
1998 Feb 23
18
Philips Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
NOTES
1998 Feb 23
19
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Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 488 3263
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Uruguay: see South America
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1998
SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/25/01/pp20
Date of release: 1998 Feb 23
Document order number: 9397 750 03253
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